![]() can be set separately of the two pointĤ,wire cutting:can set cut or no cut. can be set separately of the two pointĦ, span between first bond to second bond by automatic mode:0-10mm(motorized)ĭigital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor etc.ģ,ultrasonic power:0-5W, two channel. ![]() they are very popular for samll quantity production, school,institution,research department.Īnd the 3 automatic: automatic thin aluminum wire bonder MD-Etech1850(18-50um aluminum wire) automatic ball bonderMD-S800(15-50um Au or alloy wire) automatic heavy wire bonder MD-CWX-3710(125-500um Aluminum wire).ĭigital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.ġ,electric requirement:220VAC☑0%,50HZ,be sure connected to groundģ,ultrasonic power:0-3W, two channel. The most competitive 4 types:thin aluminum wire wedge bonder MDB-2575(25-75um aluminum wire) Wire wedge bonderMDB-25125(25-125um aluminum wire) heavy aluminum wire wedge bonder MDB-7550(75-500um aluminum wire) gold wire ball bonder MDBB-1750(17-50um gold wire). Here we provide 7 types of most competitive wire bonder, 4 Types of manual wire bonder, and 3 types of automatic wire bonder.
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